Bisphenol S
| Names | |
|---|---|
| Preferred IUPAC name 4,4′-Sulfonyldiphenol | |
| Other names BPS, 4,4′-sulfonylbisphenol, Bis(4-hydroxyphenyl)sulfone | |
| Identifiers | |
| 3D model (JSmol) | |
| ChEBI | |
| ChEMBL | |
| ChemSpider | |
| ECHA InfoCard | 100.001.137 | 
| EC Number | 
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| KEGG | |
| PubChem CID | |
| UNII | |
| CompTox Dashboard (EPA) | |
| 
 | |
| 
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| Properties | |
| C12H10O4S | |
| Molar mass | 250.27 g·mol−1 | 
| Appearance | White colorless solid; forms needle shaped crystals in water | 
| Density | 1.3663 g/cm3 | 
| Melting point | 245 to 250 °C (473 to 482 °F; 518 to 523 K) | 
| 1100 mg/L | |
| Solubility | Soluble in ethanol | 
| Hazards | |
| GHS labelling: | |
| Warning | |
| H319, H361 | |
| P201, P202, P264, P280, P281, P305+P351+P338, P308+P313, P337+P313, P405, P501 | |
| Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa). Infobox references | |
Bisphenol S (BPS, dioxydiphenylsulfone) is an organic compound with the formula (HOC6H4)2SO2. It has two phenol functional groups on either side of a sulfonyl group. It is commonly used in curing fast-drying epoxy resin adhesives. It is classified as a bisphenol, and a close molecular analog of bisphenol A (BPA). BPS differs from BPA in possessing a sulfone group (SO2) as the central linker in the molecule instead of the dimethylmethylene group (C(CH3)2) of bisphenol A.