Zen 3
| General information | |
|---|---|
| Launched | November 5, 2020 |
| Designed by | AMD |
| Common manufacturers | |
| CPUID code | Family 19h |
| Cache | |
| L1 cache | 64 KB (per core):
|
| L2 cache | 512 KB (per core) |
| L3 cache |
|
| Architecture and classification | |
| Technology node | |
| Instruction set | AMD64 (x86-64) |
| Physical specifications | |
| Transistors |
|
| Cores |
|
| Package |
|
| Sockets | |
| Products, models, variants | |
| Product code names |
|
| History | |
| Predecessor | Zen 2 |
| Successors | |
| Support status | |
| Supported | |
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan"). Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
On April 1, 2022, AMD released the new Ryzen 6000 series for laptops/mobile, using an improved Zen 3+ architecture featuring notable architectural improvements to power efficiency and power management. And slightly later, on April 20, 2022, AMD would also release the Ryzen 7 5800X3D desktop processor, which increased gaming performance by around +15% on average by using for the very first time in a PC product, a 3D vertically stacked L3 cache. Specifically in the form of a 64MB L3 cache "3D V Cache" die made on the same TSMC N7 process as the 8-core Zen 3 CCD which it gets direct copper to copper hybrid bonded to.