Quilt packaging

3x3 Chip Array Using Quilt Packaging Interconnect Technology
QP Chiplets can be quilted together in most any orientation.

Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make chip-to-chip interconnections. 

QP nodules are created as an integral part of a microchip using standard back end of the line techniques in semiconductor device fabrication. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.

Small high yielding “chiplets” made from any semiconductor material (silicon, gallium arsenide, silicon carbide, gallium nitride, etc.), can be “quilted” together to create larger multi-function meta-chip.  Thus, QP technology can integrate multiple chips with dissimilar technologies or substrate materials in planar, 2.5D and 3D configurations.

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